| US 7,579,269 B2 | ||
| Microelectronic spring contact elements | ||
| Benjamin N. Eldridge, Danville, Calif. (US); Igor Y. Khandros, Orinda, Calif. (US); Gaetan L. Mathieu, Livermore, Calif. (US); and David V. Pedersen, Scotts Valley, Calif. (US) | ||
| Assigned to FormFactor, Inc., Livermore, Calif. (US) | ||
| Filed on Apr. 08, 2004, as Appl. No. 10/821,715. | ||
| Application 10/821715 is a division of application No. 09/694205, filed on Oct. 20, 2000, granted, now 6,727,580. | ||
| Application 09/694205 is a continuation in part of application No. 08/819464, filed on Mar. 17, 1997, abandoned. | ||
| Application 08/819464 is a continuation in part of application No. 08/802054, filed on Feb. 18, 1997, granted, now 6,482,013. | ||
| Application 08/802054 is a continuation in part of application No. 08/784862, filed on Jan. 15, 1997, granted, now 6,064,213. | ||
| Application 08/784862 is a continuation in part of application No. 08/558332, filed on Nov. 15, 1995, granted, now 5,829,128. | ||
| Application 08/558332 is a continuation in part of application No. 08/554902, filed on Nov. 09, 1995, granted, now 5,974,662. | ||
| Application 08/554902 is a continuation in part of application No. 08/452255, filed on May 26, 2005, granted, now 6,336,269. | ||
| Application 08/452255 is a continuation in part of application No. 08/340144, filed on Nov. 15, 1994, granted, now 5,917,707. | ||
| Application 08/340144 is a continuation in part of application No. 08/152812, filed on Nov. 16, 1993, granted, now 5,476,211. | ||
| Claims priority of provisional application 60/030697, filed on Nov. 13, 1996. | ||
| Claims priority of provisional application 60/024555, filed on Aug. 26, 1996. | ||
| Claims priority of provisional application 60/005189, filed on May 17, 1996. | ||
| Claims priority of provisional application 60/012027, filed on Feb. 21, 1996. | ||
| Prior Publication US 2004/0198081 A1, Oct. 07, 2004 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—618 [438/14; 438/128; 324/754] | 8 Claims |
| 1. A method of making electrical connections between a first electronic component and a second electronic component, comprising:
fabricating a plurality of spring contact elements directly upon the first .electronic component, the spring contact elements
each having a tip end which is spaced above a surface of the first electronic component and at least one of the plurality
of spring contact elements being a different size than others of the plurality of spring contact elements; and
bringing the first electronic component together with a second electronic component so that the tip ends of the spring contact
elements axe in electrical contact with corresponding terminals on the second electronic component,
wherein the first electronic component is an active semiconductor device; and
the second electronic component is a test substrate; further comprising:
powering up the active semiconductor device while maintaining the tip ends of the spring contacts in electrical contact with
the terminals of the second electronic component.
|