US 7,579,257 B2
Sample separating apparatus and method, and substrate manufacturing method
Kazutaka Yanagita, Yokohama (Japan); Kazuaki Ohmi, Yokohama (Japan); and Kiyofumi Sakaguchi, Yokohama (Japan)
Assigned to Canon Kabuhsiki Kaisha, Tokyo (Japan)
Filed on Oct. 12, 2004, as Appl. No. 10/963,483.
Application 10/963483 is a division of application No. 10/330705, filed on Dec. 27, 2002, abandoned.
Application 10/330705 is a division of application No. 09/434740, filed on Nov. 05, 1999, granted, now 6,527,031.
Claims priority of application No. 10-316574 (JP), filed on Nov. 06, 1998; and application No. 11-272987 (JP), filed on Sep. 27, 1999.
Prior Publication US 2005/0045274 A1, Mar. 03, 2005
Int. Cl. H01L 21/30 (2006.01)
U.S. Cl. 438—455 21 Claims
OG exemplary drawing
 
1. A separating apparatus for separating a plate shaped sample having a separation layer at the separation layer, comprising:
a holding mechanism having a convex support portion for holding the plate shaped sample at a central portion thereof;
an ejection portion for ejecting a fluid to the plate shaped sample held by said holding mechanism to separate the plate shaped sample at the separation layer using the fluid;
an abrupt operation prevention mechanism for preventing the plate shaped sample from abruptly warping in an axial direction due to a force of the fluid acting in the plate shaped sample while allowing the plate shaped sample to moderately warp when separating the plate shaped sample.