| US 7,579,226 B2 | ||
| Thin layer element and associated fabrication process | ||
| Jean-Charles Barbe, Grenoble (France); Maud Vinet, Grenoble (France); and Olivier Faynot, Seyssinet-Pariset (France) | ||
| Assigned to Commissariat a l'Energie Atomique, Paris (France) | ||
| Filed on Aug. 19, 2005, as Appl. No. 11/211,255. | ||
| Claims priority of application No. 04 08989 (FR), filed on Aug. 19, 2004. | ||
| Prior Publication US 2006/0060846 A1, Mar. 23, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—157 [438/217; 438/514] | 20 Claims |
| 1. A method of fabricating a thin layer element comprising:
forming an assembly comprising a first material layer and a pattern of a second material, the pattern having a thickness of
less than 15 nm, and wherein the pattern is supported by the first material layer; and
implanting a chemical species into at least a portion of the assembly to reduce the contact angle between the first material
layer and the pattern to stabilize the pattern on the first material layer.
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