| US 7,579,219 B2 | ||
| Semiconductor device with a protected active die region and method therefor | ||
| George R. Leal, Cedar Park, Tex. (US); Owen R. Fay, Gilbert, Ariz. (US); and Robert J. Wenzel, Austin, Tex. (US) | ||
| Assigned to Freescale Semiconductor, Inc., Austin, Tex. (US) | ||
| Filed on Mar. 10, 2006, as Appl. No. 11/373,087. | ||
| Prior Publication US 2006/0192301 A1, Aug. 31, 2006 | ||
| Int. Cl. H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—127 [438/112; 438/124; 438/126] | 16 Claims |
| 1. A method of protecting a semiconductor die during encapsulation comprising:
providing a plurality of contact pad sites on a side of the semiconductor die;
forming a plurality of contact pads within the plurality of contact pad sites, each of the plurality of contact pads having
a substantially same predetermined height and having a first end and a second end, the first end of each of the plurality
of contact pads being in electrical contact with a predetermined corresponding different one of the plurality of contact pad
sites;
providing an encapsulant barrier at a periphery of the plurality of contact pads, the encapsulant barrier having a first surface
and a second surface, the encapsulant barrier being substantially the same predetermined height of the plurality of contact
pads, the encapsulant barrier being in physical contact with a first surface of the semiconductor die;
providing a first layer having a first surface and a second surface, the first surface of the first layer being in direct
physical contact with the second surface of the encapsulant barrier;
providing a second layer in direct physical contact with the first layer;
encapsulating the second surface of the semiconductor die and blocking an encapsulant from making physical contact with any
of the plurality of contact pads by the encapsulant barrier; and
removing the first layer and the second layer from the semiconductor die after the encapsulant has cured.
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