| US 7,578,950 B2 | ||
| Liquid crystalline polymer composition | ||
| Olaf Norbert Kirchner, Genolier (Switzerland); and Marion Glen Waggoner, Landenberg, Pa. (US) | ||
| Assigned to E. I. du Pont de Nemours and Company, Wilmington, Del. (US) | ||
| Filed on Jun. 24, 2004, as Appl. No. 10/876,075. | ||
| Claims priority of provisional application 60/484013, filed on Jul. 01, 2003. | ||
| Claims priority of provisional application 60/529920, filed on Dec. 16, 2003. | ||
| Claims priority of provisional application 60/559836, filed on Apr. 06, 2004. | ||
| Prior Publication US 2005/0029494 A1, Feb. 10, 2005 | ||
| Int. Cl. H01B 1/12 (2006.01); C09K 19/02 (2006.01); C09K 19/38 (2006.01) | ||
| U.S. Cl. 252—511 [252/299.01; 252/299.5; 252/512] | 2 Claims |
| 1. A process for forming electrically conductive pathways in an electrical or electronic apparatus by a soldering bath process,
wherein the improvement comprises, said apparatus comprises a composition comprising:
(a) a glass filler without sizing; and
(b) a thermotropic liquid crystalline polymer having a melting point of about 280° C. or more;
and provided that if one more other polymers is present in said composition, said polymers are less than 25 weight percent
of said composition.
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