| US 7,578,920 B2 | ||
| Electrolytic processing method | ||
| Ikutaro Noji, Tokyo (Japan); Hozumi Yasuda, Tokyo (Japan); Takeshi Iizumi, Tokyo (Japan); Kazuto Hirokawa, Tokyo (Japan); and Itsuki Kobata, Tokyo (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan) | ||
| Filed on Sep. 24, 2004, as Appl. No. 10/948,320. | ||
| Claims priority of application No. 2003-336327 (JP), filed on Sep. 26, 2003. | ||
| Prior Publication US 2005/0067289 A1, Mar. 31, 2005 | ||
| Int. Cl. C25D 21/12 (2006.01); C25F 3/02 (2006.01) | ||
| U.S. Cl. 205—81 [205/84; 205/147; 205/641; 205/645] | 7 Claims |
| 1. An electrolytic processing method comprising:
providing a processing electrode and a feeding electrode both covered with an ion exchanger;
bringing a processing object close to the processing electrode and the feeding electrode;
supplying ultrapure water, pure water, a liquid having an electric conductivity of not more than 500 μS/cm or an electrolytic
solution between the processing object and the processing electrode, and between the processing object and the feeding electrode;
applying a voltage between the processing electrode and the processing object via the feeding electrode while moving the processing
object and the processing electrode relative to each other, and while moving the processing object and the feeding electrode
relative to each other; and
detecting a thickness of the processing object from a change in eddy current loss by an eddy current sensor surrounded by
an insulator and located in the feeding electrode.
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