| US 7,578,887 B2 | ||
| Apparatus for and method of processing substrate | ||
| Shinji Kajita, Tokyo (Japan); Ichiro Katakabe, Tokyo (Japan); Haruko Ono, Tokyo (Japan); Yuki Inoue, Tokyo (Japan); and Sachiko Takeda, Tokyo (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan) | ||
| Filed on Jan. 28, 2004, as Appl. No. 10/765,182. | ||
| Claims priority of application No. 2003-018792 (JP), filed on Jan. 28, 2003. | ||
| Prior Publication US 2004/0211959 A1, Oct. 28, 2004 | ||
| Int. Cl. B08B 3/00 (2006.01) | ||
| U.S. Cl. 134—26 [134/18; 134/33; 134/42] | 1 Claim |

| 1. A method of processing a substrate, comprising:
processing a substrate with a substrate processing liquid and then cleaning a reverse side surface of the substrate with a
cleaning liquid supplied from a first reverse side nozzle connected to a first cleaning liquid supply line while circumferentially
surrounding the substrate, held by a substrate holder, with a tapered portion of a scattering prevention cup, wherein the
diameter of the tapered portion is progressively larger in a downward direction of the scattering prevention cup so as to
prevent the substrate processing liquid and the cleaning liquid supplied to the substrate from being scattered around;
lowering the scattering prevention cup until an upper surface of the scattering prevention cup lies substantially on the same
plane as an upper surface of the substrate held by the substrate holder so as to circumferentially surround the substrate
held by the substrate holder with a smaller-diameter portion that is connected to an upper end of the tapered portion of the
scattering prevention cup;
cleaning the substrate which has been processed by the processing liquid; and
horizontally supplying a cleaning liquid from a second reverse side nozzle connected to a second cleaning liquid supply line
to the substrate holder in a direction toward the scattering prevention cup while rotating the substrate holder, so that the
cleaning liquid from the reverse side nozzle cleans a substantially entire inner wall surface of the scattering prevention
cup and an upper surface of the substrate holder.
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