US 7,578,886 B2
Substrate processing apparatus, substrate processing method, and substrate holding apparatus
Kaoru Yamada, Tokyo (Japan); Takayuki Saito, Fujisawa (Japan); Sumio Yabe, Tokyo (Japan); Kenya Ito, Tokyo (Japan); Masayuki Kamezawa, Tokyo (Japan); Masaya Seki, Tokyo (Japan); Ichiro Katakabe, Tokyo (Japan); and Yuki Inoue, Tokyo (Japan)
Assigned to Ebara Corporation, Tokyo (Japan)
Appl. No. 10/564,980
PCT Filed Jul. 28, 2004, PCT No. PCT/JP2004/011101
§ 371(c)(1), (2), (4) Date Jan. 18, 2006,
PCT Pub. No. WO2005/015627, PCT Pub. Date Feb. 17, 2005.
Claims priority of application No. 2003-289442 (JP), filed on Aug. 07, 2003; application No. 2003-289443 (JP), filed on Aug. 07, 2003; application No. 2003-317395 (JP), filed on Sep. 09, 2003; application No. 2004-003654 (JP), filed on Jan. 09, 2004; and application No. 2004-114490 (JP), filed on Apr. 08, 2004.
Prior Publication US 2006/0234503 A1, Oct. 19, 2006
Int. Cl. B08B 5/04 (2006.01)
U.S. Cl. 134—21  [134/1.2; 134/1.3] 35 Claims
OG exemplary drawing
 
1. A substrate processing apparatus for processing a substrate while supplying a fluid to the substrate, said substrate processing apparatus comprising:
a substrate holder including rollers shaped and arranged to hold and rotate the substrate, each of said rollers having a circumferential surface and a clamp portion on said circumferential surface, said clamp portion of each of said rollers being shaped to engage and hold an edge portion of the substrate; and
a holder suction unit operable to suck the fluid from said clamp portion of each of said rollers of said substrate holder;
wherein said holder suction unit communicates with a vacuum source.