| US 7,578,668 B2 | ||
| Mold assembly having a pressure reducing device | ||
| Gerald A. Hutchinson, Coto De Caza, Calif. (US); Robert A. Lee, Bowdon Cheshire (United Kingdom); and Heinrich K. Feichtinger, Hinteregg (Switzerland) | ||
| Assigned to Advanced Plastics Technologies Luxembourg S.A., Luxemborg (Luxembourg) | ||
| Filed on Nov. 30, 2007, as Appl. No. 11/948,864. | ||
| Application 11/948864 is a continuation of application No. 11/149984, filed on Jun. 10, 2005, granted, now 7,303,387. | ||
| Claims priority of provisional application 60/654554, filed on Feb. 18, 2005. | ||
| Claims priority of provisional application 60/578501, filed on Jun. 10, 2004. | ||
| Prior Publication US 2008/0138455 A1, Jun. 12, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B29C 45/78 (2006.01) | ||
| U.S. Cl. 425—547 [425/552; 425/577] | 26 Claims |
| 1. A mold comprising:
a core section having a core surface;
a cavity section having a cavity surface, a mold cavity being defined by the core surface and the cavity surface when the
mold is in a closed position;
at least one fluid channel being disposed within one of the core section and the cavity section; and
a pressure reducing device in fluid communication with the fluid channel, the pressure reducing device being configured to
receive and at least partially vaporize a volume of a refrigerant.
|