| US 7,578,425 B2 | ||
| Wirebonding method and apparatus | ||
| Thomas Markus Kampschreur, Nijmegen (Netherlands); Joep Stokkermans, Nijmegen (Netherlands); Arjan Franklin Bakker, Eindhoven (Netherlands); Piet Christiaan Jozef Van Rens, Eindhoven (Netherlands); Arnoldus Jacobus Cornelis Bernardus De Vet, Eindhoven (Netherlands); and Piet Van Der Meer, Eindhoven (Netherlands) | ||
| Assigned to NXP B.V., Eindhoven (Netherlands) | ||
| Appl. No. 10/538,281 PCT Filed Nov. 17, 2003, PCT No. PCT/IB03/05244 § 371(c)(1), (2), (4) Date Jun. 10, 2005, PCT Pub. No. WO2004/055870, PCT Pub. Date Jul. 01, 2004. |
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| Claims priority of application No. 02080360 (EP), filed on Dec. 18, 2002. | ||
| Prior Publication US 2006/0016860 A1, Jan. 26, 2006 | ||
| Int. Cl. B23K 31/00 (2006.01) | ||
| U.S. Cl. 228—180.5 [228/4.5; 228/44.7; 228/213; 269/42; 269/63; 269/56; 438/617; 198/736] | 6 Claims |
| 1. A method for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool
to semiconductor products mounted on the respective lead frames, the lead frame assembly being indexable in an index direction
relative to a wirebonding frame, and comprising a first row of lead frames and a second row of lead frames that is adjacent
and parallel to the first row as seen in the index direction, the lead frames being spaced from each other at a lead frame
pitch in the index direction, the method comprising the steps of:
(a) clamping the leads of n adjacent lead frames of the first row by a first clamp, and wirebonding the leads of the n lead
frames of the first row to the corresponding semiconductor products;
(b) clamping the leads of n adjacent lead frames of the second row by a second clamp, and wirebonding the leads of the n lead
frames of the second row to the corresponding semiconductor products;
(c) releasing the first clamp after step (a);
(d) indexing the lead frame assembly over n lead frame pitches relative to the wirebonding frame after step (a), the second
clamp and the wirebonding tool following the index movement;
(e) releasing the second clamp after step (b);
(f) moving the second clamp opposite to the indexing direction over n lead frame pitches; and
(g) repeating steps (a)-(f).
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