| US 7,414,270 B2 | ||
| Side-emitting LED package having scattering area and backlight apparatus incorporating the LED lens | ||
| Bum Jin Kim, Kyungki-do (Korea, Republic of); Hyung Suk Kim, Kyungki-do (Korea, Republic of); Ho Sik Ahn, Incheon (Korea, Republic of); Young June Jeong, Kyungki-do (Korea, Republic of); and Sung Min Yang, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon, Kyungki-Do (Korea, Republic of) | ||
| Filed on Mar. 08, 2006, as Appl. No. 11/370,021. | ||
| Claims priority of application No. 10-2005-0022604 (KR), filed on Mar. 18, 2005. | ||
| Prior Publication US 2006/0208269 A1, Sep. 21, 2006 | ||
| Int. Cl. H01L 27/15 (2006.01); H01L 29/267 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—81 [257/79; 257/98] | 13 Claims |
| 1. A light-emitting diode package comprising:
a bottom surface;
a light exiting surface cylindrically extended around a central axis of the package from the bottom surface;
a reflecting surface positioned opposite the bottom surface and symmetrical around the central axis such that light incident
from the bottom surface is reflected toward the light exiting surface; and
a scattering area formed on the reflecting surface, wherein the reflecting surface has a concave section in an upper part
of the package and wherein the scattering area at least in part fills the concave section of the reflecting surface, and
wherein the reflecting surface has a convex internal face against which light impinges and a concave external face which defines
the concave section and on which scattering material which comprises the scattering area is disposed.
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