| US 7,413,069 B2 | ||
| Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility | ||
| Todd J. Brill, Round Rock, Tex. (US); Michael Teferra, Los Gatos, Calif. (US); Amitabh Puri, San Jose, Calif. (US); Daniel R. Jessop, Eagle Mountain, Utah (US); Glade L. Warner, Sandy, Utah (US); and David C. Duffin, Sandy, Utah (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Feb. 25, 2005, as Appl. No. 11/67,460. | ||
| Claims priority of provisional application 60/548574, filed on Feb. 28, 2004. | ||
| Prior Publication US 2005/0245101 A1, Nov. 03, 2005 | ||
| Int. Cl. B65G 47/46 (2006.01) | ||
| U.S. Cl. 198—358 [198/349; 198/349.6] | 24 Claims |
| 1. A method of electronic device manufacturing, comprising:
receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of
an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further
includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility;
assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the
second substrate loading station such that a time required for the transfer is reduced relative to a time required for the
transfer if a next available carrier support is assigned;
moving the carrier from the first substrate loading station; and
moving the carrier to the second substrate loading station.
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