| US 7,577,493 B2 | ||
| Temperature regulating method, thermal processing system and semiconductor device manufacturing method | ||
| Masashi Sugishita, Toyama (Japan); and Masaaki Ueno, Toyama (Japan) | ||
| Assigned to Hitachi Kokusai Electric Inc., Tokyo (Japan) | ||
| Appl. No. 11/663,198 PCT Filed Nov. 28, 2005, PCT No. PCT/JP2005/021763 § 371(c)(1), (2), (4) Date May 29, 2007, PCT Pub. No. WO2006/070552, PCT Pub. Date Jul. 06, 2006. |
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| Claims priority of application No. 2004-375768 (JP), filed on Dec. 27, 2004. | ||
| Prior Publication US 2008/0046110 A1, Feb. 21, 2008 | ||
| Int. Cl. G06F 19/00 (2006.01); G02B 21/00 (2006.01); H01L 21/331 (2006.01); H01L 21/336 (2006.01); F27D 19/00 (2006.01); F27B 9/02 (2006.01); H05B 1/02 (2006.01); H01L 21/8238 (2006.01); A21B 1/00 (2006.01) | ||
| U.S. Cl. 700—207 [700/121; 700/209; 700/274; 438/225; 438/362; 438/297; 432/49; 432/128; 219/411; 219/494; 219/497] | 16 Claims |
| 1. A temperature regulating method in a thermal processing system comprising a heater for heating an interior of a process
chamber to process a substrate, a heating control section for controlling the heater, a first one of a thermocouple and a
pyrometer for detecting a temperature in the process chamber, and a second one of a thermocouple and a pyrometer for detecting
a temperature in the process chamber, wherein the first one of the thermocouple and the pyrometer is arranged in a position
closer to the substrate than the second one of the thermocouple and the pyrometer, while the second one of the thermocouple
or the pyrometer is arranged in a position closer to the heater than the first one of the thermocouple and the pyrometer,
the temperature regulating method comprising:
controlling the heater by performing integral operation, differential operation and proportional operation by the heating
control section, according to a detection temperature, by the first one of the thermocouple and the pyrometer, comprising
a predetermined target temperature;
determining a first output control pattern by patterning a first operation amount for the heating control section to control
the heater depending upon a detection temperature detected by the first one of the thermocouple and the pyrometer, in the
controlling of the heater by performing integral operation, differential operation and proportional operation;
controlling the heater by the heating control section, depending upon the first output control pattern according to a detection
temperature, detected by the first one of the thermocouple and the pyrometer, comprising the predetermined target temperature;
determining a first heat amount, at from a ramp-up start time to a time of maximum temperature, of a detection temperature
detected by the second one of the thermocouple and the pyrometer in the controlling of the heater by the heating control section,
and determining a second output control pattern by patterning at least a part of a second operation amount, at from the ramp-up
start time to the time of maximum temperature, for the heating control section to control the heater according to a second
heat amount which is obtained by subtracting an output amount based on the proportional operation from the first heat amount;
and
processing the substrate while controlling the heater by the heating control section according to the second output control
pattern.
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