| US 7,576,437 B2 | ||
| Printed circuit board of semiconductor package and method for mounting semiconductor package using the same | ||
| Seong-Chan Han, Cheonan-si (Korea, Republic of); Dong-Chun Lee, Cheonan-si (Korea, Republic of); Kwang-Su Yu, Cheonan-si (Korea, Republic of); Dong-Woo Shin, Cheonan-si (Korea, Republic of); Hyo-Jae Bang, Cheonan-si (Korea, Republic of); Hyun-Seok Choi, Cheonan-si (Korea, Republic of); and Si-Suk Kim, Cheonan-si (Korea, Republic of) | ||
| Assigned to Samsung Electronic Co., Ltd., Gyeonggi-do (Korea, Republic of) | ||
| Filed on Nov. 14, 2006, as Appl. No. 11/598,755. | ||
| Claims priority of application No. 10-2005-0108731 (KR), filed on Nov. 14, 2005. | ||
| Prior Publication US 2007/0109758 A1, May 17, 2007 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—779 [257/773; 257/786; 257/696; 257/E23.031] | 16 Claims |
| 1. A printed circuit board, comprising:
an insulating substrate for a printed circuit board on which a semiconductor package having leads is mounted;
pads on a surface of the insulating substrate and to which the leads of the semiconductor package are connected; and
a solder resist covering the insulating substrate and including openings in the solder resist exposing at least a portion
of the pads to which the leads of the semiconductor package are connected,
wherein the pads include a solder moving portion for allowing an adhesion solder coated on each pad to move to a shoulder
portion of the semiconductor package lead when the semiconductor package lead is connected to the pad,
the solder moving portion includes:
a first treated surface portion formed by surface treating one end of the pad, to which one end of the semiconductor package
lead is connected, with a water-soluble oxidization inhibiting material; and
a second treated surface portion formed by surface treating a portion of the pad, to which the lead shoulder portion opposite
to the end of the semiconductor package lead is connected, with a plating metal.
|