| US 7,576,415 B2 | ||
| EMI shielded semiconductor package | ||
| Sang Jin Cha, Kyunggi-do (Korea, Republic of); and Hyeongno Kim, Kyunggi-do (Korea, Republic of) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
| Filed on Jun. 15, 2007, as Appl. No. 11/763,858. | ||
| Prior Publication US 2008/0308912 A1, Dec. 18, 2008 | ||
| Int. Cl. H01L 23/552 (2006.01) | ||
| U.S. Cl. 257—659 [257/660] | 9 Claims |
| 1. A semiconductor package, comprising:
a substrate having a ground trace;
a chip disposed on the substrate;
at least one shielding conductive block formed on the substrate and electrically connected to the ground trace;
a sealant formed on the substrate and covering the chip and shielding conductive block, the sealant having a side surface
to expose a surface of the shielding conductive block; and
a conductive film formed on the outer surface of the sealant and covering the exposed shielding conductive block to electrically
connect to the shielding conductive block.
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