| US 7,576,403 B2 | ||
| Method of manufacturing infrared rays receiver and structure thereof | ||
| Wei Chang, San Chung (Taiwan) | ||
| Assigned to Unity Opto Technology Co., Ltd., Taipei Hsien (Taiwan) | ||
| Filed on Aug. 23, 2007, as Appl. No. 11/892,436. | ||
| Claims priority of application No. 96119287 A (TW), filed on May 30, 2007. | ||
| Prior Publication US 2008/0297665 A1, Dec. 04, 2008 | ||
| Int. Cl. H01L 23/28 (2006.01); H01L 21/56 (2006.01) | ||
| U.S. Cl. 257—434 [257/680; 257/E21.502; 438/64; 438/116; 438/124] | 8 Claims |
| 1. A method of manufacturing an infrared rays receiver, comprising the steps of:
(a) chip attach: attaching an infrared rays receiving chip to one pin of a lead frame;
(b) wire-bonding: connecting said infrared rays receiving chip with the other pins of said lead frame by a plurality of bonding
wires;
(c) encapsulation: encapsulating part of said lead frame, said infrared rays receiving chip and said bonding wires into a
unity by a light-pervious adhesive;
(d) metal housing covering: covering said light-pervious adhesive with a metal housing having a through hole on one side;
(e) encapsulation: encapsulating said metal housing with a colored adhesive;
(f) pin cutting: cutting off a plurality of connection sections of said lead frame; and
(g) testing: performing a testing on said infrared rays receiver obtained above.
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