| US 7,576,303 B2 | ||
| Wafer holder, and wafer prober provided therewith | ||
| Masuhiro Natsuhara, Itami (Japan); Tomoyuki Awazu, Itami (Japan); Hirohiko Nakata, Itami (Japan); and Katsuhiro Itakura, Itami (Japan) | ||
| Assigned to Sumitomo Electric Industries, Ltd., Osaka (Japan) | ||
| Filed on Feb. 02, 2007, as Appl. No. 11/701,417. | ||
| Claims priority of application No. 2006-043803 (JP), filed on Feb. 21, 2006. | ||
| Prior Publication US 2007/0205788 A1, Sep. 06, 2007 | ||
| Int. Cl. H05B 3/68 (2006.01); C23C 16/00 (2006.01) | ||
| U.S. Cl. 219—444.1 [118/724] | 8 Claims |
| 1. A wafer holder comprising:
a chuck top configured and arranged to mount a wafer;
a support member configured and arranged to support the chuck top, the support member being made from a metal or metal-ceramic
complexes; and
a stand configured and arranged to support the support member, wherein the chuck top, the support member and the stand are
separate elements that are stacked together, with a heat insulation structure provided in the chuck top, the support member,
or between the chuck top and the support member, and wherein
the chuck top has a thermal conductivity K1 and a Young's modulus Y1,
the support member has a thermal conductivity K2 and a Young's modulus Y2, and
the stand has a thermal conductivity K3 and a Young's modulus Y3, with
K1>K2 and K1>K3, and
Y3>Y1 and Y3>Y2.
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