US 7,576,288 B2
	Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards
Masayoshi Kondo, Akita (Japan); Masaaki Kato, Akita (Japan); Toshiaki Chuma, Akita (Japan); Satoru Nakao, Akita (Japan); and Kentaro Fujiura, Akita (Japan)
Assigned to Sumitomo Bakelite Company Limited, (Japan)
Appl. No. 10/534,962 PCT Filed Nov. 19, 2003, PCT No. PCT/JP03/14741 § 371(c)(1), (2), (4) Date May 16, 2005, PCT Pub. No. WO2004/049772, PCT Pub. Date Jun. 10, 2004.
Claims priority of application No. 2002-344568 (JP), filed on Nov. 27, 2002.
Prior Publication US 2006/0042826 A1, Mar. 02, 2006
Int. Cl. H05K 1/00 (2006.01)

U.S. Cl. 174—254  [174/255; 174/262]

7 Claims

1. A multilayer wiring board comprising (i) a plurality of single-sided wiring boards having a wiring pattern formed on one side of a substrate made of an insulating material and two-layer conductor posts made of copper and a metal or copper and an alloy, each of said conductor posts projecting from said wiring pattern to a side of said substrate opposite from said wiring pattern, with each substrate other than that of an outermost layer having, on the side opposite from said conductor posts, a plurality of pads for making connection to the conductor posts, and said wiring pattern having no surface coating, (ii) a flexible wiring board having on at least one side thereof the pads for connection to said conductor posts and comprising a wiring pattern with surface coating applied on a flexible portion but substantially no surface coating applied on a multilayer rigid portion, and (iii) an adhesive layer having a flux function whereby respective boards are laminated integrally, forming the multilayer rigid portion, wherein said conductor posts and pads are connected by a metal or an alloy through the medium of said adhesive layer, and said wiring patterns are electrically connected.