| US 7,575,812 B2 | ||
| Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor | ||
| Yoshio Terada, Ibaraki (Japan); Hirofumi Fujii, Ibaraki (Japan); Makoto Namikawa, Ibaraki (Japan); Daisuke Uenda, Ibaraki (Japan); and Yasuhiro Amano, Ibaraki (Japan) | ||
| Assigned to Nitto Denko Corporation, Osaka (Japan) | ||
| Filed on Oct. 19, 2005, as Appl. No. 11/252,800. | ||
| Claims priority of application No. P.2004-304027 (JP), filed on Oct. 19, 2004; and application No. P.2005-297735 (JP), filed on Oct. 12, 2005. | ||
| Prior Publication US 2006/0141258 A1, Jun. 29, 2006 | ||
| Int. Cl. B32B 27/06 (2006.01); B32B 7/12 (2006.01); B08B 7/00 (2006.01) | ||
| U.S. Cl. 428—473.5 [134/4; 134/6; 134/8; 428/343; 428/355 N] | 11 Claims |
| 1. A cleaning substrate of a substrate processing equipment, which comprises:
a substrate, and
a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate.
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