	US 7,574,787 B2
	Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure
Baomin Xu, Cupertino, Calif. (US); Steven A. Buhler, Sunnyvale, Calif. (US); Michael C. Welsberg, Woodside, Calif. (US); William S. Wong, San Carlos, Calif. (US); Scott E. Solberg, Mountain View, Calif. (US); Karl A. Littau, Palo Alto, Calif. (US); John S. Fitch, Los Altos, Calif. (US); and Scott A. Elrod, La Honda, Calif. (US)
Assigned to Palo Alto Research Center Incorporated, Palo Alto, Calif. (US)
Filed on Feb. 28, 2006, as Appl. No. 11/363,849.
Application 11/363849 is a division of application No. 10/376544, filed on Feb. 25, 2003, granted, now 7,089,635.
Prior Publication US 2009/0113685 A1, May 07, 2009
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 17/00 (2006.01)

U.S. Cl. 29—25.35 [29/831; 29/846; 29/423; 29/25.42; 310/328]

22 Claims

1. A method of producing at least one piezoelectric element comprising:

depositing a piezoelectric ceramic material onto a first surface of at least one first reusable single layer substrate structure to form at least one piezoelectric element structure, wherein a first surface of the piezoelectric ceramic material and the first surface of the first reusable single layer substrate are in direct contact;

depositing an electrode on a second surface of the at least one piezoelectric element structure;

bonding the at least one piezoelectric element structure to a second substrate, the second substrate being conductive or having a conductive layer;

removing the at least one first reusable single layer substrate from the at least one piezoelectric element structure;

depositing a second side electrode on the first surface of the at least one piezoelectric element structure; and

poling, by applying a DC voltage to the at least one piezoelectric element structure, to provide the at least one piezoelectric element structure with piezoelectric characteristics.