CPC H10K 19/201 (2023.02) [H10K 19/10 (2023.02); H01L 28/10 (2013.01)] | 18 Claims |
1. An integrated circuit (IC) package, comprising:
an IC package substrate having a horizontal IC package substrate major plane;
a die mount base arranged on the IC package substrate and having a horizontal die mount base substrate major plane parallel to the horizontal IC package substrate major plane;
a vertically-mounted die (VMD) mounted to the die mount base in a vertical orientation, the VMD comprising a VMD die substrate having a vertical die substrate major plane; and
an integrated inductor having a core magnetic field (B field) extending parallel to at least one of (a) the IC package substrate major plane and (b) the VMD die substrate major plane.
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