CPC H05K 7/20272 (2013.01) [B23K 31/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 9/18 (2013.01); H05K 7/2039 (2013.01); H05K 7/20263 (2013.01); H05K 7/20336 (2013.01); B23K 2101/14 (2018.08); F28F 2230/00 (2013.01); F28F 2245/00 (2013.01); F28F 2275/062 (2013.01); G06F 1/20 (2013.01)] | 9 Claims |
1. A liquid cooling head manufacturing method, comprising:
providing a liquid channel main body;
disposing a heat dissipation bottom plate and a heat sink in different recessed indentations in the liquid channel main body;
welding the heat dissipation bottom plate and the heat sink in the liquid channel main body; and
sealing a cover plate to the liquid channel main body.
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