CPC H05K 3/244 (2013.01) [C25D 3/48 (2013.01); C25D 5/022 (2013.01); C25D 5/48 (2013.01); C25D 7/123 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 1/11 (2013.01); H05K 3/108 (2013.01); H05K 3/181 (2013.01); H05K 3/188 (2013.01); C25D 3/38 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/098 (2013.01); H05K 2201/099 (2013.01); H05K 2201/0989 (2013.01); H05K 2203/1184 (2013.01)] | 20 Claims |
1. A circuit board comprising:
an insulating layer;
a first metal layer disposed on the insulating layer; and
a second metal layer disposed on the first metal layer,
wherein the first metal layer includes:
an upper surface in contact with the second metal layer,
a lower surface facing the insulating layer, and
a side surface disposed between the upper surface and the lower surface
wherein the side surface of the first metal layer includes:
a first side surface connected to the upper surface of the first metal layer and etched inward of the first metal layer; and
a second side surface connecting the first side surface and the lower surface of the first metal layer,
wherein at least a part of the first side surface overlaps the second metal layer in a vertical direction, and
wherein the first side surface has a slope in which a width of the first metal layer changes toward the second side surface of the first metal layer.
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