US 11,722,220 B2
System comprising packaged optical devices
Chang-Yu Lin, Kaohsiung (TW); Cheng-Yuan Kung, Kaohsiung (TW); and Hung-Yi Lin, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jan. 8, 2021, as Appl. No. 17/144,938.
Application 17/144,938 is a continuation of application No. 16/702,209, filed on Dec. 3, 2019, granted, now 10,903,907.
Prior Publication US 2021/0167856 A1, Jun. 3, 2021
Int. Cl. H04B 10/00 (2013.01); H04B 10/40 (2013.01); G02B 6/42 (2006.01); H04J 14/00 (2006.01)
CPC H04B 10/40 (2013.01) [G02B 6/4206 (2013.01); G02B 6/4257 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A system comprising optical devices, the system comprising:
a first substrate;
a light source on the first substrate;
a first device on the first substrate;
a second device on the first substrate; and
additional first devices disposed adjacent to one side of the second device, wherein the first device and the additional first devices share the light source, wherein a distance between the first device and the second device is smaller than a distance between the light source and the second device.