US 11,721,949 B1
Non-contact wafer-level burn-in comprising a wireless power transfer component
Chien-Yao Lu, San Jose, CA (US)
Assigned to Lumentum Operations LLC, San Jose, CA (US)
Filed by Lumentum Operations LLC, San Jose, CA (US)
Filed on Jun. 27, 2022, as Appl. No. 17/809,146.
Claims priority of provisional application 63/269,830, filed on Mar. 23, 2022.
Int. Cl. H02J 50/12 (2016.01); H01S 5/00 (2006.01); H01S 5/42 (2006.01)
CPC H01S 5/0021 (2013.01) [H02J 50/12 (2016.02); H01S 5/423 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electro-optical system, comprising:
a test bed configured to receive a semiconductor wafer with a set of optical emitters,
wherein an optical emitter, of the set of optical emitters, is associated with a receiver conducting medium for receiving wireless power transfer;
a wireless power transfer component configured to transfer power to the set of optical emitters of the semiconductor wafer,
wherein the wireless power transfer component is associated with a power charging conducting medium to couple to the receiver conducting medium for wireless power transfer,
wherein the power charging conducting medium and the receiver conducting medium are associated with a common resonant frequency for wireless power transfer; and
a receiver component configured to measure an optical output of the set of optical emitters.