US 11,721,884 B2
Semiconductor device package and method of manufacturing the same
Guo-Cheng Liao, Kaohsiung (TW); and Yi Chuan Ding, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Apr. 5, 2021, as Appl. No. 17/222,875.
Application 17/222,875 is a continuation of application No. 16/375,640, filed on Apr. 4, 2019, granted, now 10,971,798.
Claims priority of provisional application 62/747,580, filed on Oct. 18, 2018.
Prior Publication US 2021/0226317 A1, Jul. 22, 2021
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 21/48 (2013.01); H01L 21/4853 (2013.01); H01L 23/498 (2013.01); H01L 23/49816 (2013.01); H01L 23/66 (2013.01); H01Q 1/22 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a substrate;
a first antenna comprising a first antenna pattern and a protection layer in contact with a lateral surface of the first antenna pattern;
a first support structure disposed on the substrate and configured to support the first antenna; and
a second antenna and a second support structure configured to support the second antenna, wherein the first antenna and the second antenna are disposed at different elevation,
wherein the second antenna comprises a first antenna pattern aligned with the first antenna pattern of the first antenna in a direction substantially perpendicular to the substrate, wherein the second antenna has an opening exposing a second antenna pattern of the first antenna.