US 11,721,883 B2
Semiconductor package with antenna and method of forming the same
Wen-Shiang Liao, Miaoli County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Feb. 25, 2021, as Appl. No. 17/185,850.
Prior Publication US 2022/0271414 A1, Aug. 25, 2022
Int. Cl. H01Q 5/00 (2015.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 1/48 (2006.01); H01Q 1/40 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/40 (2013.01); H01Q 1/48 (2013.01); H01Q 9/0407 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a semiconductor die;
an encapsulation layer, laterally encapsulating the semiconductor die; and
at least one antenna structure, embedded in the encapsulation layer aside the semiconductor die, wherein the at least one antenna structure comprises a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer,
wherein a top surface of the semiconductor die, a top surface of the encapsulation layer and a top surface of the at least one antenna structure are flushed with each other.