US 11,721,705 B1
Array substrate and method for manufacturing the same, and display panel
Zhiwei Li, Sichuan (CN); and Baohong Kang, Sichuan (CN)
Assigned to MIANYANG HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and HKC CORPORATION LIMITED, Guangdong (CN)
Filed by Mianyang HKC Optoelectronics Technology Co., Ltd., Sichuan (CN); and HKC Corporation Limited, Guangdong (CN)
Filed on Dec. 28, 2022, as Appl. No. 18/89,722.
Claims priority of application No. 202210072612.6 (CN), filed on Jan. 21, 2022.
Int. Cl. H01L 27/12 (2006.01); G02F 1/1362 (2006.01)
CPC H01L 27/124 (2013.01) [G02F 1/136222 (2021.01); G02F 1/136295 (2021.01); H01L 27/1262 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An array substrate, comprising:
a base substrate having a first surface and a second surface opposite to the first surface;
a stacked structure disposed on the first surface of the substrate, the stacked structure comprising:
a contact pad disposed on the first surface of the base substrate, wherein the base substrate defines a first via hole at a position corresponding to the contact pad, the first via hole penetrating the first surface and the second surface of the base substrate;
a common-electrode layer connected with the contact pad; and
a gate line isolated from the common-electrode layer and the contact pad;
a common-electrode line disposed on the second surface of the base substrate, wherein an orthographic projection of the gate line on a plane where the common-electrode line is located at least partially overlaps with the common-electrode line; and
a conductive structure connected with the contact pad, and connected to the common-electrode line through the first via hole.