CPC H01L 23/66 (2013.01) [H01L 23/5386 (2013.01); H01L 25/16 (2013.01); H01L 2224/02379 (2013.01)] | 20 Claims |
1. An electronic device comprising:
a wafer-level fan-out package comprising:
a first integrated circuit (IC) die comprising a transmitter circuit, the transmitter circuit comprising a serializer circuit configured to receive parallel data, serialize the parallel data, and output serialized data, the transmitter circuit being configured to transmit the serialized data as multiple single-ended data signals;
a second IC die comprising a receiver circuit; and
a redistribution structure comprising physical channels electrically connected to and between the transmitter circuit and the receiver circuit, the transmitter circuit being configured to transmit the multiple single-ended data signals and a differential clock signal through the physical channels to the receiver circuit, the receiver circuit being configured to capture data from the multiple single-ended data signals using a first single-ended clock signal based on the differential clock signal.
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