US 11,721,645 B2
Semiconductor package device and semiconductor process
Wen-Long Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jul. 6, 2021, as Appl. No. 17/368,688.
Application 17/368,688 is a continuation of application No. 16/547,539, filed on Aug. 21, 2019, granted, now 11,056,446.
Prior Publication US 2021/0335729 A1, Oct. 28, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/564 (2013.01) [H01L 21/4853 (2013.01); H01L 21/566 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a semiconductor chip;
an encapsulant encapsulating the semiconductor chip;
a wiring structure disposed on the encapsulant and electrically connected to the semiconductor chip, wherein the wiring structure includes a dielectric layer, and the dielectric layer has a roughened surface; and
an under bump metallization (UBM) on the dielectric layer.