CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/16 (2013.01); H01L 23/3185 (2013.01); H01L 23/585 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01)] | 20 Claims |
1. A semiconductor package, comprising:
a package substrate;
a semiconductor device mounted on a surface of the package substrate;
a first ring disposed over the surface of the package substrate and surrounding the semiconductor device, wherein the first ring has a bottom surface facing the surface of the package substrate and a top surface opposite the bottom surface of the first ring;
a second ring disposed over the top surface of the first ring, wherein the second ring has a bottom surface facing the top surface of the first ring and a top surface opposite the bottom surface of the second ring, and wherein a protruding part extends from one of the top surface of the first ring and the bottom surface of the second ring, and a recessed part is recessed from the other of the top surface of the first ring and the bottom surface of the second ring, wherein an opposite surface of the one of the top surface of the first ring and the bottom surface of the second ring having the protruding part has a recess aligned with the protruding part, wherein the protruding part extends into and engages with the recessed part; and
an adhesive layer disposed between the surface of the package substrate and the bottom surface of the first ring.
|