CPC H01L 22/32 (2013.01) [H01L 21/56 (2013.01); H01L 22/22 (2013.01); H01L 22/34 (2013.01); H01L 23/3121 (2013.01); H01L 23/544 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/06517 (2013.01)] | 20 Claims |
1. A method comprising:
stacking a plurality of first dies on a first carrier substrate to form a device stack;
bonding a second carrier substrate to the device stack;
removing the first carrier substrate from the device stack;
after removing the first carrier substrate, testing the device stack;
after testing the device stack, bonding a second die to the device stack;
singulating the second carrier substrate to form a first device package; and
bonding the first device package to a package substrate.
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