CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] | 20 Claims |
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and an internal electrode;
an electrode layer connected to the internal electrode; and
a conductive resin layer disposed on the electrode layer, and including a first conductive metal, a metal having a lower melting point than the first conductive metal, a conductive carbon, and a base resin,
wherein the metal having the lower melting point than the first conductive metal is tin (Sn),
wherein the first conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd), and
wherein the conductive carbon connects the first conductive metal and the metal having the lower melting point than the first conductive metal to each other.
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