US 11,721,485 B2
Multilayer ceramic electronic parts
Hye Hun Park, Suwon-si (KR); Won Kuen Oh, Suwon-si (KR); Tae Gyeom Lee, Suwon-si (KR); and Ji Hong Jo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 25, 2022, as Appl. No. 17/704,741.
Application 17/704,741 is a continuation of application No. 17/005,775, filed on Aug. 28, 2020, granted, now 11,315,733.
Claims priority of application No. 10-2019-0115900 (KR), filed on Sep. 20, 2019.
Prior Publication US 2022/0223347 A1, Jul. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and an internal electrode;
an electrode layer connected to the internal electrode; and
a conductive resin layer disposed on the electrode layer, and including a first conductive metal, a metal having a lower melting point than the first conductive metal, a conductive carbon, and a base resin,
wherein the metal having the lower melting point than the first conductive metal is tin (Sn),
wherein the first conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd), and
wherein the conductive carbon connects the first conductive metal and the metal having the lower melting point than the first conductive metal to each other.