CPC G01N 27/30 (2013.01) [B32B 27/30 (2013.01); H01M 50/1245 (2021.01); H01M 50/184 (2021.01); H01M 50/186 (2021.01); B32B 2274/00 (2013.01); B32B 2405/00 (2013.01)] | 21 Claims |
1. A package structure for a chemical system, comprising:
a first substrate;
a second substrate, opposing to the first substrate;
an inner glue frame, disposed between the first substrate and the second substrate for forming an accommodating space, and a chemical system accommodated in the accommodating space; and
a first outer glue frame, disposed between the first substrate and the second substrate, and located on an outer side of the inner glue frame;
a second protection layer, disposed between the first glue frame and the first substrate;
wherein the inner glue frame is selected from a thermosetting plastic and the first outer glue frame is selected from a thermoplastic, the first outer glue frame includes a first glue frame and a second glue frame; the first glue frame is disposed on an inner side of the first substrate; and the second glue frame is disposed on an inner side of the second substrate and combined with the first glue frame.
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