CPC C08K 3/01 (2018.01) [C08K 3/30 (2013.01); C08K 3/32 (2013.01); C08K 5/0008 (2013.01); C23C 18/1612 (2013.01); C25D 5/56 (2013.01); G03F 7/2053 (2013.01); H05K 1/0373 (2013.01); H05K 3/105 (2013.01)] | 9 Claims |
1. A method for manufacturing electrically conductive structures, comprising:
providing a non-conductive carrier material which contains at least one inorganic metal phosphate compound and at least one stabiliser finely distributed or dissolved therein; and
irradiating the carrier material in regions by laser beams generating the electrically conductive structures in the irradiated regions,
wherein the at least one inorganic metal phosphate compound is copper hydroxide phosphate of the general formula Cu2(OH)PO4, and
wherein the at least one stabiliser is selected from Lewis acids, wherein a Lewis acid is defined as a non-proton-transferring electron-deficient compound selected from sodium aluminium sulphate (SAS), dicalcium phosphate dihydrate (DCPD), sodium aluminium phosphate (SALP), calcium magnesium aluminium phosphate, calcium polyphosphate, magnesium polyphosphate, aluminium hydroxide, alkyl boranes, aluminium alkyls, iron(II) salts and mixtures of the foregoing.
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