CPC B22F 10/28 (2021.01) [B33Y 10/00 (2014.12); F28D 1/05383 (2013.01); F28F 2260/02 (2013.01)] | 16 Claims |
1. A process for forming a microchannel heat exchanger core, the process comprising the steps of:
providing one or more plate substrates;
printing microchannel walls on the one or more plate substrates using an additive manufacturing (AM) process, thereby producing one or more AM featured plates;
bonding the one or more AM featured plates together to form the microchannel heat exchanger core, the bonding step adapted to simultaneously join the AM featured plates and densify the microchannel walls; and
forming hot and cold inlet and outlet headers adjacent to the microchannel walls.
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