US 7,573,727 B2
Connecting device for contacting a semiconductor component
Henning Hauenstein, El Segundo, Calif. (US); and Dirk Balszunat, Stuttgart (Germany)
Assigned to Robert Bosch GmbH, Stuttgart (Germany)
Appl. No. 10/514,104
PCT Filed Jan. 10, 2003, PCT No. PCT/DE03/00052
§ 371(c)(1), (2), (4) Date May 11, 2005,
PCT Pub. No. WO03/096417, PCT Pub. Date Nov. 20, 2003.
Claims priority of application No. 102 21 085 (DE), filed on May 11, 2002.
Prior Publication US 2005/0225957 A1, Oct. 13, 2005
Int. Cl. H05K 1/11 (2006.01); H05K 1/14 (2006.01)
U.S. Cl. 361—803  [361/749; 361/760; 174/254] 19 Claims
OG exemplary drawing
 
1. A connecting device for contacting a semiconductor component to at least one further semiconductor component, the connecting device comprising:
at least one metal connecting strip extending in a longitudinal direction and including a contact region for mounting on a terminal region of the semiconductor component;
wherein the contact region is structured and flexible with respect to stresses that extend in a terminal plane parallel to the terninal region;
wherein the structured contact region includes a deformation reservoir for deformations in the terminal plane;
wherein at least one portion of the structured contact region is mounted on at least one terminal region of the at least one further semiconductor component; and
wherein each portion of the structured contact region that is mounted on the terminal region is structured and flexible with respect to stresses that extend in terminal plane parallel to the terminal region and includes a deformation reservoir for deformations in the terminal plane.