US 7,572,494 B2
Process for packaging plastic materials like hot melt adhesives
Atul Mehta, 5760 Timber Ridge Dr., New Berlin, Wis. 53151 (US); Michael A. Neperud, 4335 Cherokee Trail, Hubertus, Wis. 53033 (US); Nicolas E. Sajot, 2628 N. 84 St., Wauwatosa, Wis. 53226 (US); Dominique Chiarabini, 457, chemin du Chatelain, Noyon 60400 (France); and Chrisophe Morel-Fourrier, 7 rue Plichon, Paris 75011 (France)
Filed on Dec. 14, 2007, as Appl. No. 11/956,612.
Application 11/956612 is a division of application No. 10/976943, filed on Oct. 29, 2004, granted, now 7,328,547.
Prior Publication US 2008/0118689 A1, May 22, 2008
Int. Cl. B29D 22/00 (2006.01); B29D 23/00 (2006.01); B32B 1/08 (2006.01)
U.S. Cl. 428—35.7  [428/35.2; 428/220; 428/35.6; 428/500; 524/480; 524/487] 29 Claims
OG exemplary drawing
 
1. A package, comprising:
a plastic mass having a finite size and shape; and
a polymeric film surrounding said plastic mass, said polymeric film having a composition comprising:
at least about 25% by weight of a wax material; and
wherein the film composition has an enthalpy of fusion of at least about 100 J/g and an elongation value at break of at least about 100%.