| US 7,572,481 B2 | ||
| Pattern forming method and pattern forming apparatus | ||
| Michinori Shinkai, Yokohama (Japan); and Satoshi Suzuki, Fujisawa (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Dec. 20, 2004, as Appl. No. 11/14,803. | ||
| Claims priority of application No. 2003-424991 (JP), filed on Dec. 22, 2003. | ||
| Prior Publication US 2005/0147737 A1, Jul. 07, 2005 | ||
| Int. Cl. B05D 5/12 (2006.01); C23C 16/52 (2006.01) | ||
| U.S. Cl. 427—97.3 [427/8; 427/97.1; 427/256] | 3 Claims |
| 1. A laminated pattern forming method which form patterns on a base by ejecting a pattern forming material from a jet head
to the base and then laminating thus formed patterns, said method comprising:
a first step of forming a pattern on the base by scanning the jet head in a plane parallel to a surface of the base;
a second step of adjusting the jet head relative to the surface of the base and forming a pattern on a side surface of the
pattern formed on the base, the side surface being tilted relative to the surface of the base; and
a third step of adjusting a position of the jet head in a direction perpendicular to the base, in correspondence to a thickness
of the pattern formed on the base, and laminating a pattern on the pattern formed on the base in a plane parallel to the surface
of the base;
wherein the adjustment of the jet head in the second step is executed using information acquired from the viscosity of the
pattern forming material and the adjustment of the jet head in the third step is executed using information acquired from
the number of times of ejection by the jet head.
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