| US 7,571,770 B2 | ||
| Downhole cooling based on thermo-tunneling of electrons | ||
| Rocco DiFoggio, Houston, Tex. (US); and Frederick E. Shipley, Houston, Tex. (US) | ||
| Assigned to Baker Hughes Incorporated, Houston, Tex. (US) | ||
| Filed on Mar. 23, 2005, as Appl. No. 11/87,362. | ||
| Prior Publication US 2006/0213660 A1, Sep. 28, 2006 | ||
| Int. Cl. E21B 36/00 (2006.01) | ||
| U.S. Cl. 166—302 [166/57] | 30 Claims |
| 1. An apparatus for cooling electronic components in a borehole, the apparatus comprising:
(a) a quantum thermocooler configured to use quantum thermotunneling to maintain downhole electronic components below a predefined
temperature;
wherein a temperature of the borehole is higher than the predefined temperature.
|