| US 7,570,344 B2 | ||
| Exposure apparatus and device manufacturing method | ||
| Shinichi Shima, Utsunomiya (Japan); and Yasuo Takama, Utsunomiya (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Mar. 20, 2008, as Appl. No. 12/52,086. | ||
| Claims priority of application No. 2007-097629 (JP), filed on Apr. 03, 2007. | ||
| Prior Publication US 2008/0246938 A1, Oct. 09, 2008 | ||
| Int. Cl. G03B 27/42 (2006.01); G03B 27/52 (2006.01) | ||
| U.S. Cl. 355—53 [355/55] | 2 Claims |
| 1. An exposure apparatus which exposes a substrate via a liquid, comprising:
a projection optical system configured to project a pattern of a reticle onto the substrate;
a substrate stage configured to hold the substrate and move;
a top plate which is arranged on the substrate stage and in which an opening is formed; and
a measurement member which is arranged in the opening formed in the top plate arranged on the substrate stage,
wherein a gap is formed between the top plate and the measurement member in a plane perpendicular to an optical axis of the
projection optical system, and
wherein the exposure apparatus satisfies following formula:
γ·cos θ1·L1+γ·cos θ2·L2+Pf·S<0
where θ1 is a contact angle between the measurement member and the liquid, L1 is an outer circumferential length of the measurement member in the plane, θ2 is a contact angle between the top plate and the liquid, L2 is an inner circumferential length of the opening in the plane, Pf is a liquid pressure of the liquid which has partially
entered the gap, γ is a surface tension of the liquid, and S is an area of the gap in the plane.
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