| US 7,569,918 B2 | ||
| Semiconductor package-on-package system including integrated passive components | ||
| Mark A. Gerber, Lucas, Tex. (US); Kurt P. Wachtler, Richardson, Tex. (US); and Abram M. Castro, Fort Worth, Tex. (US) | ||
| Assigned to Texas Instruments Incorporated, Dallas, Tex. (US) | ||
| Filed on May 01, 2006, as Appl. No. 11/380,953. | ||
| Prior Publication US 2007/0254404 A1, Nov. 01, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—676 [257/724; 438/107] | 16 Claims |
| 1. A semiconductor system comprising:
a first active device including:
a first substrate having a first and a second surface, and electrical contact pads on the first and the second surface; and
a first semiconductor chip having active electrical components;
an integrated passive device including:
a second substrate having a third and a fourth surface, and electrical contact pads on the third and the fourth surface; and
passive electrical components assembled on the third surface; and
first metal reflow bodies, having a first reflow temperature, electrically connecting the contact pads on the first and the
fourth surface to electrically connect; and second metal reflow bodies attached to the contact pads on the second substrate
surface, the second reflow bodies having a second reflow temperature lower than the first reflow temperature.
|