| US 7,569,424 B2 | ||
| Method of forming a wall structure in a microelectronic assembly | ||
| Michael J. Nystrom, San Jose, Calif. (US); Christopher Paul Wade, Los Gatos, Calif. (US); and Giles Humpston, Aylesbury (United Kingdom) | ||
| Assigned to Tessera, Inc., San Jose, Calif. (US) | ||
| Filed on Nov. 15, 2006, as Appl. No. 11/600,289. | ||
| Prior Publication US 2008/0113470 A1, May 15, 2008 | ||
| Int. Cl. H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—119 [438/118; 438/116] | 18 Claims |
| 1. A method of forming a wall structure in a microelectronic assembly, the method comprising:
selectively depositing a flowable material on an upper surface of a first element of the microelectronic assembly by screen
printing the flowable material at selected positions on the upper surface or utilizing a stencil to deposit the flowable material
at selected positions on the upper surface;
positioning a molding surface in contact with the deposited flowable material; and
controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned
between the upper surface and the molding surface.
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