| US 7,569,410 B2 | ||
| Method for integrated MEMS packaging | ||
| John W. Hartzell, Camas, Wash. (US); Harry Garth Walton, Beckley Oxford (United Kingdom); and Michael James Brownlow, Drayton (United Kingdom) | ||
| Assigned to Sharp Laboratories of America, Inc., Camas, Wash. (US) | ||
| Filed on Dec. 18, 2006, as Appl. No. 11/640,592. | ||
| Application 11/640592 is a division of application No. 11/178148, filed on Jul. 08, 2005, granted, now 7,217,588. | ||
| Application 11/178148 is a continuation in part of application No. 11/031320, filed on Jan. 05, 2005, granted, now 7,253,488. | ||
| Application 11/031320 is a continuation in part of application No. 10/131318, filed on Apr. 23, 2002, granted, now 7,125,451, filed on Oct. 24, 2006. | ||
| Application 10/131318 is a continuation in part of application No. 10/131006, filed on Apr. 23, 2002, granted, now 7,128,783, filed on Oct. 31, 2006. | ||
| Application 10/131006 is a continuation in part of application No. 10/131057, filed on Apr. 23, 2002, granted, now 6,860,939, filed on Mar. 01, 2005. | ||
| Application 10/131057 is a continuation in part of application No. 10/131549, filed on Apr. 23, 2002, granted, now 7,156,916. | ||
| Application 10/131549 is a continuation in part of application No. 10/131808, filed on Apr. 23, 2002, granted, now 7,135,070, filed on Nov. 14, 2006. | ||
| Application 10/131808 is a continuation in part of application No. 10/131551, filed on Apr. 23, 2002, abandoned. | ||
| Prior Publication US 2007/0099327 A1, May 03, 2007 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—51 [438/55; 438/106] | 20 Claims |
| 1. A method for packaging a microelectromechanical system (MEMS) device, the method comprising:
providing a first substrate having a first region with boundaries;
forming an electrical circuit on a second region of the first substrate, electrically connected to the first substrate;
integrating a MEMS device on the first region, electrically connected to the first substrate;
providing a second substrate overlying the first substrate; and,
forming a wall along the first region boundaries, between the first and second substrates, hermetically enclosing the MEMS
device.
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