| US 7,569,308 B2 | ||
| Rectangular contact lithography for circuit performance improvement and manufacture cost reduction | ||
| Jun Wang, Hong Kong (China); Alfred K. Wong, Hong Kong (China); and Edmund Y. Lam, Hong Kong (China) | ||
| Assigned to The University of Hong Kong, Hong Kong (China) | ||
| Filed on Feb. 24, 2005, as Appl. No. 11/65,413. | ||
| Claims priority of provisional application 60/546948, filed on Feb. 24, 2004. | ||
| Prior Publication US 2005/0196685 A1, Sep. 08, 2005 | ||
| Int. Cl. G03F 9/00 (2006.01); G03F 7/20 (2006.01) | ||
| U.S. Cl. 430—5 [430/311; 430/394; 430/322] | 15 Claims |
| 1. An optical lithography method to fabricate integrated circuits, comprising:
placing rectangular contacts on a grid in a first direction;
placing rectangular contacts unrestrictedly in a second direction substantially perpendicular to the first direction;
wherein said placing rectangular contacts on said grid in said first direction comprises exposing a reusable template mask
to form periodic dark lines; and
wherein said placing rectangular contacts unrestrictedly in a second direction comprises exposing a trim mask on the periodic
dark lines to form the rectangular contacts.
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