| US 7,569,159 B2 | ||
| Hole injection/transport layer compositions and devices | ||
| Troy D. Hammond, Pittsburgh, Pa. (US); Shawn P. Williams, Pittsburgh, Pa. (US); Elena Sheina, Pittsburgh, Pa. (US); Darin W. Laird, Pittsburgh, Pa. (US); Christopher Greco, Pittsburgh, Pa. (US); and Brian Woodworth, Pittsburgh, Pa. (US) | ||
| Assigned to Plextronics, Inc., Evanston, Ill. (US) | ||
| Filed on Feb. 09, 2006, as Appl. No. 11/350,271. | ||
| Claims priority of provisional application 60/651211, filed on Feb. 10, 2005. | ||
| Prior Publication US 2006/0175582 A1, Aug. 10, 2006 | ||
| Int. Cl. H01B 1/00 (2006.01); H01L 35/24 (2006.01); C08G 75/00 (2006.01) | ||
| U.S. Cl. 252—500 [257/40; 528/377] | 33 Claims |
| 1. A blend composition for use in a hole injection layer or hole transport layer comprising the following components:
(i) at least one intrinsically conductive polymer or copolymer,
(ii) at least one dopant for the conductive polymer or copolymer; and
(iii) at least one planarizing agent, wherein the planarizing agent is a synthetic polymer; wherein the components are soluble in non-aqueous solvents and are formulated to form a compatible blend when the composition
is in the form of a hole injection layer or hole transport layer less than about 200 nm thick, wherein the intrinsically conductive
polymer or copolymer is a regioregular 3-substituted polythiophene.
|