| US 7,569,118 B2 | ||
| Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method | ||
| Junichiro Iri, Kawasaki (Japan); Toshio Kashino, Fujisawa (Japan); and Genji Inada, Kawasaki (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Apr. 25, 2005, as Appl. No. 11/113,665. | ||
| Claims priority of application No. 2004-132415 (JP), filed on Apr. 28, 2004; application No. 2004-135193 (JP), filed on Apr. 30, 2004; application No. 2004-353693 (JP), filed on Dec. 07, 2004; application No. 2004-353694 (JP), filed on Dec. 07, 2004; and application No. 2005-117693 (JP), filed on Apr. 15, 2005. | ||
| Prior Publication US 2005/0241754 A1, Nov. 03, 2005 | ||
| Int. Cl. B32B 38/00 (2006.01); B29C 65/14 (2006.01); B32B 38/10 (2006.01) | ||
| U.S. Cl. 156—275.1 [156/247; 156/268; 156/275.5; 156/344; 438/464; 438/976] | 5 Claims |
| 1. A method for dicing a wafer having a first face, dicing streets, and openings defined in the first face, along the dicing
streets, the method comprising the steps of:
affixing a dicing tape having first adhesive regions and second adhesive regions to the first face such that the dicing tape
lies over the openings, the first adhesive regions are exposed in the openings, and the second adhesive regions correspond
to the dicing streets; and
after the affixing step, treating the dicing tape to reduce adhesive strengths of the first and second adhesive regions such
that the adhesive strength of the second adhesive regions is less than the adhesive strength of the first adhesive regions.
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