US 7,569,083 B2
Gas diffusion electrode assembly, bonding method for gas diffusion electrodes, and electrolyzer comprising gas diffusion electrodes
Shinji Katayama, Tamano (Japan); Kiyohito Asaumi, Tamano (Japan); Hiroaki Aikawa, Kawasaki (Japan); Tsugiyoshi Osakabe, Nagoya (Japan); Mitsuharu Hamamori, Nagoya (Japan); Tatsuhito Kimura, Yokohama (Japan); Koji Saiki, Toyonaka (Japan); Kenji Nonomura, Kakogawa (Japan); Naoya Okada, Tokuyama (Japan); and Osamu Ichinose, Takaishi (Japan)
Assigned to Chlorine Engineers Corp. Ltd., Tokyo (Japan); Tosoh Corporation, Shin-Nanyo-Shi (US); Mitsui Chemicals, Inc., Tokyo (Japan); Toagosei Co., Ltd., Tokyo (Japan); Kaneka Corporation, Osaka-Shi (Japan); Asahi Glass Company, Limited, Tokyo (Japan); Asahi Kasei Chemicals Corporation, Tokyo (Japan); Daiso Co., Ltd., Osaka-Shi (Japan); and Tokuyama Corporation, Shunan-Shi (Japan)
Filed on Jul. 01, 2008, as Appl. No. 12/216,232.
Application 12/216232 is a division of application No. 10/812422, filed on Mar. 30, 2004, granted, now 7,404,878.
Claims priority of application No. 2003-093992 (JP), filed on Mar. 31, 2003; application No. 2003-093993 (JP), filed on Mar. 31, 2003; application No. 2003-145088 (JP), filed on May 22, 2003; and application No. 2003-154996 (JP), filed on May 30, 2003.
Prior Publication US 2008/0271847 A1, Nov. 06, 2008
Int. Cl. H01M 4/04 (2006.01)
U.S. Cl. 29—623.4  [29/623.1; 29/623.5; 29/746; 429/32; 429/35; 429/36; 204/283; 204/284] 13 Claims
 
1. A bonding method for a gas diffusion electrode assembly, characterized in that a covering sheet is covered on a junction where gas diffusion electrodes are bonded together, and an adhesive composition containing a corrosion-resistant synthetic resin is coated on said covering sheet for bonding.