| US 7,567,416 B2 | ||
| Transient voltage protection device, material, and manufacturing methods | ||
| Kyle Yun-Su Kim, Manteca, Calif. (US); Hundi Panduranga Kamath, Los Altos, Calif. (US); and Daniel Minas Manoukian, San Ramon, Calif. (US) | ||
| Assigned to Cooper Technologies Company, Houston, Tex. (US) | ||
| Filed on Jul. 21, 2005, as Appl. No. 11/186,514. | ||
| Prior Publication US 2007/0019346 A1, Jan. 25, 2007 | ||
| Int. Cl. H01H 1/00 (2006.01); H01B 1/12 (2006.01); H01C 7/10 (2006.01) | ||
| U.S. Cl. 361—126 [361/127; 252/519.33; 338/21] | 19 Claims |
| 1. A transient voltage suppression device comprising:
first and second dielectric layers each defining at least one variable impedance opening therein;
at least one electrode extending between the first dielectric layer and including at least one gap that interrupts a conductive
path through the at least one electrode, the at least one electrode being an electroformed foil formed independently of the
first and second dielectric layers and integrally formed with the at least one gap, wherein the at least one electrode is
sandwiched between the first and second dielectric layers; and the at least one variable impedance opening of the first and
second dielectric layers being positioned proximate the at least one gap;
third and fourth dielectric layers situated on the first and second dielectric layers, respectively, wherein the third and
fourth layers close the at least one variable impedance opening in the first and second dielectric layers, respectively, and
the first, second, third and fourth dielectric layers are secured to one another to form a chip structure;
a variable impedance material situated in the at least one variable impedance opening of the first and second dielectric layers
and substantially surrounding the at least one electrode from above and below; and
surface mount terminations establishing a conductive path to the at least one electrode on either side of the at least one
gap.
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