| US 7,566,964 B2 | ||
| Aluminum pad power bus and signal routing for integrated circuit devices utilizing copper technology interconnect structures | ||
| Seung H. Kang, Macungie, Pa. (US); Roland P. Krebs, Allentown, Pa. (US); Kurt George Steiner, Fogelsville, Pa. (US); Michael C. Ayukawa, Zionsville, Pa. (US); and Sailesh Mansinh Merchant, Breinigsville, Pa. (US) | ||
| Assigned to Agere Systems Inc., Allentown, Pa. (US) | ||
| Filed on Sep. 30, 2003, as Appl. No. 10/675,258. | ||
| Claims priority of provisional application 60/462504, filed on Apr. 10, 2003. | ||
| Prior Publication US 2004/0201101 A1, Oct. 14, 2004 | ||
| Int. Cl. H01L 23/52 (2006.01) | ||
| U.S. Cl. 257—691 [257/668; 257/701; 257/750; 257/765; 257/E21.591] | 7 Claims |
| 1. An integrated circuit device comprising:
a metallization interconnect system overlying a semiconductor substrate, the metallization interconnect system including at
least a first and a second interconnect feature located within a dielectric layer;
a power bus located over the metallization interconnect system, the power bus comprising an alloy of aluminum and copper,
and further wherein the power bus includes a first contact pad region configured for connection external to the integrated
circuit device that is in contact with the first interconnect feature, and a second region in contact with the second interconnect
feature; and
a passivation layer overlying at least a portion of the power bus to expose at least a portion of the first contact pad region
and protect the second region.
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